Machine-learning guided strain-relief patterns for maximizing stretchability of printed conductors

Authors

Rui Chen, Eastern Michigan University
Suresh K. Sitaraman, Georgia Institute of Technology

Document Type

Conference Proceeding

Publication Date

2024

Department/School

Engineering Technology

Publication Title

2024 IEEE 74th Electronic Components and Technology Conference (ECTC)

Comments

R. Chen is a faculty member in EMU's School of Engineering.

Link to Published Version

DOI: 10.1109/ECTC51529.2024.00080

Recommended Citation

Chen, R., & Sitaraman, S. K. (2024). Machine-learning guided strain-relief patterns for maximizing stretchability of printed conductors. 2024 IEEE 74th Electronic Components and Technology Conference (ECTC), 472–477. https://doi.org/10.1109/ECTC51529.2024.00080